M.2 (S42) 3TE7

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M.2 (S42) 3TE7

M.2

32GB ~ 1TB

Features

SATA III Solution for industrial field
Exclusive L³ architecture
DRAM-less, 100% data integrity
Excellent random performance
Supports TRIM / NCQ / S.M.A.R.T.
Built-in iData Guard
Designed with hardware LDPC ECC engine
Supports wide temperature from -40°C to 85°C

BORN FOR SUPERIOR PERFORMANCE

Innodisk M.2 (S42) 3TE7 is SATA III 6.0 Gb/s Flash based disk, which adopts latest SATA III NAND controller with Innodisk’s exclusive L³ FW architecture. The upgraded L³ FW architecture, combining Innodisk signature 4K mapping algorithm L² FW architecture with powerful LDPC technology, makes 3TE7 series have outstanding high IOPS, better data integrity and extended lifespan through reducing the bad block number happening. Built-in thermal sensor, and iData Guard ensure data integrity and reliability of 3TE7 for industrial applications.

Innodisk M.2 (S42) 3TE7 is designed for industrial field, and supports several standard features, including TRIM, NCQ, and S.M.A.R.T. In addition, Innodisk’s exclusive industrial-oriented firmware provides a flexible customization service, making it perfect for a variety of industrial applications.

SPECIFICATIONS

Model Name	M.2 (S42) 3TE7
Flash Type	3D TLC
Interface	SATA III 6.0 Gb/s
Form Factor	M.2 2242 B+M Key
Capacity	32GB ~ 1TB
Sequential R / W (MB/sec, max.)	550 / 520
P/E Cycle	3,000
TBW (Max.)	1,200
Storage Temperature	-40°C ~ 85°C
Max. Power Consumption	1.5W
Max. Channels	4
External DRAM Buffer	N
Feature	AES, H/W Write Protect, S.M.A.R.T.
Dimension (W x L x H/mm)	22.0 x 42.0 x 3.5
Vibration	20G@[7 ~ 2000Hz]
Shock	1500G@0.5ms
MTBF	>3 million hours
Warranty	3 Years

ORDER INFORMATION

Operating Temperature	Standard Grade (0°C ~ 70°C)	Industrial Grade (-40°C ~ 85°C)
32GB	DEM24-32GDK1EC1SF	DEM24-32GDK1EW1SF
64GB	DEM24-64GDK1%C*DF	DEM24-64GDK1%W*&F
128GB	DEM24-A28DK1%C*DF	DEM24-A28DK1%W*DF
256GB	DEM24-B56DK1%C*&F	DEM24-B56DK1%W*&F
512GB	DEM24-C12DK1%CAQF	DEM24-C12DK1%WAQF
1TB	DEM24-01TDK1%CAQF	DEM24-01TDK1%WAQF

%. E : 64 layers 3D TLC / G : 96 layers 3D TLC / K : 112 layers 3D TLC
*. PCB version control
&. S : 1 channel / D : 2 channels / Q : 4 channels

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